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START499D
NPN RF silicon transistor
Features

High efficiency Common emitter configuration Broadband performances POUT = 29 dBm with 14 dB gain @ 900 MHz Plastic package Linear and non linear operation Supplied in tape and reel In compliance with the 2002/95/EC european directive Figure 1. Pin connection
SOT-89
Description
The START499D provide the market with a Si state-of-art RF process. Manufactured with ST 3rd generation bipolar process, it offers the highest power, gain and efficiency in SOT-89 for given breakdown voltage (BVCEo). START499D is suitable for a wide range of application up to 1 GHz.
Emitter
Base
Emitter Collector
Table 1.
Device summary
Marking D499 Package SOT-89 Packaging Tape and reel
Order code START499D
June 2010
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Contents
START499D
Contents
1 Electrical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.1 1.2 Maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
2
Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
2.1 2.2 Static . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Dynamic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
3 4 5 6
Impedance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Typical performance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Test circuit, part list and photo . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
6.1 6.2 Thermal pad and via design . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Soldering profile . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
7
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
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START499D
Electrical data
1
1.1
Electrical data
Maximum ratings
Table 2.
Symbol VCEO VEBO IC PDISS TJ TSTG
Absolute maximum ratings (TCASE = +25 C)
Parameter Collector - emitter voltage Emitter - base voltage Collectorcurrent Power dissipation Max. operating junction temperature Storage temperature Value 4.5 1.5 1.0 1.7 150 -65 to +150 Unit V V A W C C
1.2
Thermal data
Table 3.
Symbol RthJC
Thermal data
Parameter Junction - case thermal resistance Value 75 Unit C/W
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Electrical characteristics
START499D
2
2.1
Electrical characteristics
Static
Table 4.
Symbol ICBO IEBO BVCES hFE VCB = 15 V VEB = 1.2 V IC = 200 A VCE = 3 V IC = 0.16 A 15 20 150
Static TCASE = +25 oC
Test conditions Min. Typ. Max. 5 250 Unit A A V
2.2
Dynamic
Table 5.
Symbol POUT GP hD Load VCC = 3.6 V, ICQ = 30 mA, POUT = 28 dBm, f = 900 MHz mismatch All phase angles VCC = 3.6 V, ICQ = 30 mA, PIN = 15 dBm, f = 900 MHz
Dynamic
Test conditions Min. 28 13 55 3:1 Typ. 29 14 65 Max. Unit dBm dB % VSWR
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Impedance
3
Impedance
Figure 2. Current conventions
C
ZL
ZS
B E
Table 6.
Impedance data
ZBS () 16.58 - j4.04 15.81 - j3.81 15.04 - j3.53 14.31 - j3.21 13.61 - j2.83 12.93 - j2.44 12.27 - j2.01 11.66 - j1.53 11.06 - j1.04 10.52 - j0.54 9.98 + j0.02 ZCL() 17.95 - j5.49 16.28 - j5.11 14.77 - j4.67 13.44 - j4.15 12.25 - j3.54 11.19 - j2.90 10.24 - j2.22 9.40 - j1.52 8.65 - j0.81 7.99 - j0.11 7.38 + j0.62
Frequency (MHz) 800 820 840 860 880 900 920 940 960 980 1000
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Typical performance
START499D
4
Figure 3.
Typical performance
DC output characterisitics Figure 4. BVEBO
START499D
START499D
Figure 5.
BVCES
START499D
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Typical performance
Figure 6.
20
Gain vs frequency
Figure 7.
80
Efficiency vs frequency
18
75
Pin=13dBm Pin=14dBm Pin=15dBm
70 Efficiency [%]
Pin=13dBm Pin=14dBm Pin=15dBm
16 Gain[dB]
65
14
60 Vcc = 3.6V Icq = 30mA
12
55
Vcc = 3.6V Icq = 30mA
10 800
820
840
860
880
900
920
940
960
980
1000
50 800 820 840 860 880 900 920 940 960 980 1000 Frequency [MHz]
Frequency [MHz]
Figure 8.
17
Gain and efficiency vs frequency
y q Gain Efficiency y
100
Figure 9.
0
Harmonics vs frequency
16
90
-10
15 80
Vcc = 3.6V Icq = 30mA Pout = 28dBm
-20
Efficiency [%] 14 Gain [dB] 70
Harmonics [dBc]
-30
13
60
-40
12 50
11
Vcc = 3.6V Icq = 30mA Pout = 28dBm
40
-50 H_2nd H_3rd -60 800
10 800
820
840
860
880
900
920
940
960
980
30 1000
Frequency [MHz]
820
840
860
880
900
920
940
960
980 1000
Frequency [MHz]
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Typical performance
START499D
Figure 10. Input return loss vs frequency
0
Figure 11. Gain vs output power
20
-2
-4
Vcc = 3.6V Icq = 30mA Pout = 28dBm
18
16 Gain [dB]
-6 IRL [dB]
860MHz 910MHz 960MHz
14
-8
-10
12 Vcc = 3.6V Icq = 30mA 10
-12
-14 800
820
840
860
880
900
920
940
960
980
1000
8 22 23 24 25 26 27 28 29 30 Output Power [dBm]
Frequency [MHz]
Figure 12. Efficiency vs output power
70
Figure 13. Gain vs output power
18
65
Vcc = 3 V Icq = 30mA
860MHz 910MHz 960MHz
17
60
55 Efficiency [%]
16
Gain [dB]
50
15
45
40
14
35
30
Vcc = 3.6V Icq = 30mA
13
860MHz 910MHz 960MHz
25 22 23 24 25 26 27 28 29 30
12 21 22 23 24 25 26 27 28 Output Pow er [dBm]
Output Pow er [dBm]
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Typical performance
Figure 14. Efficiency vs output power
70
Figure 15. Gain vs output power
18
65
60
860MHz 910MHz 960MHz
17
860MHz 910MHz 960MHz
55 Efficiency [%]
16
Gain [dB]
50
15
45
40
35
Vcc = 3 V Icq = 30mA
14
Vcc = 2 V Icq = 30mA
13
30
25 21 22 23 24 25 26 27 28 Output Pow er [dBm]
12 16 17 18 19 20 21 22 23 24 Output Pow er [dBm]
Figure 16. Efficiency vs output power
70
65
60
860MHz 910MHz 960MHz
55 Efficiency [%]
50
45
40
35
Vcc = 2 V Icq = 30mA
30
25 16 17 18 19 20 21 22 23 24 Output Pow er [dBm]
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Test circuit, part list and photo
START499D
5
Test circuit, part list and photo
Figure 17. Test circuit schematic
18 m A
V cc 3. 6 V
FR4 Er = 4 .5 H = 2 0 mil
C1 1 R3
C6
C7
C8
R2 BJT2 B C8 4 7
B1
L2
C9
C1 0
L3 C 12 C5 R1
L1
TL 4 RF _ in C1 C2 T L1 T L2 TL 3 BJT1 S TA RT4 9 9D
TL 5
C4
RF_ o ut TL 6 C3
Table 7.
Components part list
Description Capacitor Capacitor Capacitor Capacitor Capacitor Capacitor Inductor Inductor Inductor Ferrite bead Resister Resister Potentiometer 30 ohm 180 ohm 10 K 1608 1608 Bourns electronics 3214W-1-103E Value 100 pF 5.6 pF 6.8 pF 1 nF 10 nF 1 uF 11 nH 100 nH 5.4 nH Case size 1608 1608 1608 1608 1608 1608 1608 1608 2012 Manufacturer Murata Murata Murata Murata Murata Murata Coilcraft Coilcraft Coilcraft Panasonic Part code GRM1885C1H101JA01 GRM1885C1HR50CZ01 GRM1885C1H6R8CZ01 GRM1885C1H102JA01 GRM188R71H103KA01 GRM188R71H105KA01 0603CS-11NXGB 0603CS-R10XGB 0906-5JLB EXCELDRC35C 1608 chip resister (0.063 W, 5 %)
Component ID C1,C3,C5,C9 C2 C4 C6,C10,C11 C7 C8 L1 L2 L3 B1 R1 R3 R2 TL1 TL2 TL3
Transmission line L=11.9 mm W=0.9 mm Transmission line Transmission line L=5.0 mm L=5.2 mm W=0.9 mm W=0.9 mm
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START499D Table 7. Components part list (continued)
Description Transmission line Transmission line Value L=3.5 mm L=2.8 mm Case size W=0.9 mm W=0.9 mm
Test circuit, part list and photo
Component ID TL4 TL5 TL6 BJT2 BJT1 Board
Manufacturer
Part code
Transmission line L=12.2 mm W=0.9 mm BJT BJT STMicroelectronics STMicroelectronics FR4 Er=4.5 THk=0.020" 1OZ Cu both sides BC847 START499D
Figure 18. Photo
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Package mechanical data
START499D
6
Package mechanical data
In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK(R) packages, depending on their level of environmental compliance. ECOPACK(R) specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark.
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START499D Table 8.
Dim. Min A B B1 C C1 D D1 E e e1 H L 1.4 0.44 0.36 0.35 0.35 4.4 1.62 2.40 1.42 2.92 3.94 0.89
Package mechanical data SOT-89 mechanical data
mm. Typ Max 1.6 0.56 0.48 0.44 0.44 4.6 1.83 2.6 1.57 3.07 4.25 1.2 Min 55.1 17.3 14.2 13.8 13.8 173.2 63.8 94.5 55.9 115.0 155.1 35.0 Inch Typ Max 63.0 22.0 18.9 17.3 17.3 181.1 72.0 102.4 61.8 120.9 167.3 47.2
Figure 19. Package dimensions
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Package mechanical data
START499D
6.1
Thermal pad and via design
Thernal vias are required in the PCB layout to effectively conduct heat away from the package. The via pattern has been designed to address thermal, power dissipation and electrical requirements of the device. The via pattern is based on thru-hole vias with 0.203 mm to 0.330 mm finished hole size on a 0.5 mm to 1.2 mm grid pattern with 0.025 plating on via walls. If micro vias are used in a design, it is suggested that the quantity of vias be increased by a 4:1 ratio to achieve similar results. Figure 20. Pad layout details
SOT-89
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Package mechanical data
6.2
Soldering profile
Figure 21 shows the recommeded solder for devices that have Pb-free terminal plating and where a Pb-free solder is used. Figure 21. Recommended solder profile
Figure 22 shows the recommeded solder for devices with Pb-free terminal plating used with leaded solder, or for devices with leaded terminal plating used with a leaded solder. Figure 22. Recommended solder profile for leaded devices
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Package mechanical data Figure 23. Reel information
START499D
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START499D
Revision history
7
Revision history
Table 9.
Date 03-Mar-2008 15-Jul-2008 17-Jul-2008 29-Jun-2010
Document revision history
Revision 1 2 3 4 Initial release. Updated Table 1 on page 1. Values update on Table 4 on page 4. Updated Table 8 on page 13. Changes
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START499D
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